What's New - 2017

 

Green500 Drives Power Efficiency for Exascale - List of most power efficient supercomputers shows continued improvement in Gigaflops/Watt.

 

In-Memory Computing Demonstrated using Phase-Change Memories - IBM researchers demonstrated accelerated machine learning in PCM memory array.

 

Next-Generation Resistive RAM being developed - ReRAMs are fast non-volatile switches for memories and neural networks.

 

Stanford Researchers Demonstrate New Ultrathin Semiconductors - HfSe2 and ZrSe2 semiconductors function in layers as thin as 3 atoms, and form passivating oxides.

 

US Timeline for Exascale Computing - US Dept. of Energy labs plan demonstration of exascale system by 2023.

 

DARPA Continues Investment in Post-Moore’s Technologies - New Electronics Resurgence Initiative to fund research into new electronic materials, circuits, architectures, and designs tools.

 

Testing Brain-Inspired Chips for Big Data Problems at Berkeley Lab - IBM True North Chips applied to complex image analysis in high-energy physics, structural biology, materials science, and cosmology.

 

New 3D Chip Combines Computing and Data Storage - Researchers at MIT and Stanford integrate layers of carbon nanotube transistors and resistive RAM on the same chip.

 

New Graph Analytic Computer Being Developed - Funded by DARPA, massively parallel non-von-Neumann processor designed for Big Data applications.

 

IRDS™ White Papers Featured - Tom Conte, co-chair of IRDS™ interviewed about future of semiconductor industry.

 

NASA High Performance Fast Computing Challenge (HPFCC) - NASA has an open competition to speed up supercomputer simulations of computational fluid dynamics, with a deadline of June 29, and top prizes up to $55,000.

 

Neuromorphic Chip Composes Music - IMEC in Belgium has designed a neuromorphic chip that can be trained using musical passages to compose music on its own.

 

Intel Universal Memory Technology - Intel has developed a new faster type of solid-state hard drive for data centers, based on a technology known as 3D XPoint.

 

Google Tensor Processing Unit - TPU is ASIC chip designed for neural networks and machine learning, for use with TensorFlow software.

 

Rambus Cryo DRAM - Rambus is collaborating with Microsoft researchers to develop new CMOS DRAM chips designed to operate at cryogenic temperatures of 90 K or below, for possible future use with cryogenic processors.

 

Proposed DNA computer faster than conventional supercomputers - Manchester University (UK) researchers use exponential parallelism to design a non-deterministic universal Turing machine.

 

IBM Research Team Demonstrates magnetic storage using single atoms - This could lead to a storage density factor of 1000x greater than current technology.

 

Underwater Data Centers? - Microsoft proposes possibility of data centers under the ocean surface to improve energy efficiency.

 

IBM predicts breakthroughs in next 5 years - AI, smart sensors, and medical devices.

 

IEEE Computer Society predicts the future of technology - Key innovations will include machine learning, non-volatile memories, and brain-computer interfaces.

 

3D Nanocomputer Prototype Designed - Research at UCSB by Prof. Dmitri Strukov uses 3D arrays of memristors.

 

HPE Demonstrates Memory-Driven Computer Architecture - Prototype part of “The Machine” research project based on non-volatile memory and optical data links.